MediaTek’s new Dimensity 1050 chipset adds mmWave 5G support

The Taiwanese chipset manufacturer MediaTek has just presented three new SoCs aimed at the mid-range market: Dimensity 1050, Dimensity 930 and Helio G99. The most interesting is the Dimensity 1050 since it offers mmWave Support for 5G, one of the networks primarily used by Verizon in the United States.

More importantly, the new Dimensity 1050 chipset is manufactured by TSMC on a 6nm process. Although this means that it is one of the smallest chipsets for smartphones, it retains the same performance and power consumption as chipsets built using the 7nm process.

In terms of specifications, the Size 1050 The chipsets house an octa-core processor consisting of two Cortex-A78 cores clocked at 2.5 GHz and six Cortex-A55 cores running at 2.0 GHz, along with a Mali-G610 MC3 graphics processing unit (GPU). .

It’s also important to add that MediaTek’s Dimensity 1050 SoC can seamlessly switch between long-range sub-6GHz connections and ultra-fast 5G mmWave connections. On top of that, the chipset can connect to both simultaneously, delivering speeds up to 53% faster than other chipsets that can only connect to 4G LTE and mmWave simultaneously.

Finally, the Dimensity 1050 supports FHD+ display at up to 144Hz refresh rate, native 10-bit color HDR support, as well as HDR10+ Adaptive and Dolby Vision. MediaTek has also confirmed that the handset maker can build multi-camera smartphones with up to 108MP primary cameras. Thanks to the Imagiq 760 HDR-IPS, smartphones equipped with Dimensity 1050 chipsets will benefit from dual HDR video capture support (it can record on two cameras simultaneously).

According to MediaTek, the first smartphones powered by its new Dimensity 1050 chipsets are expected to arrive in the third quarter of 2022.